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KMM5324004CSW Datenblatt(PDF) 21 Page - Samsung semiconductor |
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KMM5324004CSW Datenblatt(HTML) 21 Page - Samsung semiconductor |
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21 / 21 page ![]() DRAM MODULE KMM5324004CSW/CSWG PACKAGE DIMENSIONS .133(3.38) 4.250(107.95) 3.984(101.19) R.062 ±.004(R1.57±.10) .250(6.35) 3.750(95.25) .250(6.35) Units : Inches (millimeters) 0.125 MIN .100(2.54) MAX .054(1.37) Tolerances : ±.005(.13) unless otherwise specified NOTE : The used device is 4Mx16 DRAM, TSOPII DRAM Part No. : KMM5324004CSW/CSWG -- KM416C4104CS (400 mil) 1.000(25.40) .400(10.16) .125 DIA ±.002(3.18±.051) R.062(1.57) .250(6.35) .080(2.03) .047(1.19) ( Back view ) ( Front view ) Gold/Solder Plating Lead .010(.25)MAX .050(1.27) .041 ±.004(1.04±.10) (3.20MIN) |
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