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TMPC1005H-R90MG-D Datenblatt(PDF) 2 Page - TAI-TECH Advanced Electronics Co., Ltd. |
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TMPC1005H-R90MG-D Datenblatt(HTML) 2 Page - TAI-TECH Advanced Electronics Co., Ltd. |
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2 / 4 page ![]() TAI-TECH P3 5. Specification Part Number Inductance L0 (uH)±20% I rms ( A ) Typ I sat ( A ) Typ DCR (mΩ) Typ. @25℃ DCR (mΩ) Max. @25℃ Type TMPC1005H-R22MG-D 0.22 45 70 0.45 0.5 non-leadframe TMPC1005H-R30MG-D 0.30 38 65 0.57 0.61 non-leadframe TMPC1005H-R56MG-D 0.56 26.5 43 1.3 1.5 non-leadframe TMPC1005H-R90MG-D 0.90 25 32 2.2 3.0 non-leadframe TMPC1005H-1R0MG-D 1.00 22 30 2.8 3.5 non-leadframe TMPC1005H-1R2MG-D 1.20 20 28 2.9 3.5 non-leadframe TMPC1005H-1R3MG-D 1.30 20 28 3.2 3.7 non-leadframe TMPC1005H-1R5MG-D 1.50 19 27 3.5 4.1 non-leadframe TMPC1005H-1R8MG-D 1.80 17.5 25.5 3.7 4.7 non-leadframe TMPC1005H-2R2MG-D 2.20 16 24 5.4 6.0 leadframe TMPC1005H-3R3MG-D 3.30 14 22 9.0 10.4 leadframe TMPC1005H-4R7MG-D 4.70 13 19 10 12.5 leadframe TMPC1005H-5R0MG-D 5.0 12 18 12.2 15 leadframe TMPC1005H-5R6MG-D 5.60 10 16 14 16.8 leadframe TMPC1005H-6R8MG-D 6.80 9.5 15 16.5 21 leadframe TMPC1005H-8R2MG-D 8.20 9.0 14.5 18.5 24 leadframe TMPC1005H-100MG-D 10.0 8.0 13.5 25 29 leadframe TMPC1005H-120MG-D 12.0 6.0 10 30 35 leadframe TMPC1005H-150MG-D 15.0 5.5 9.5 37 45 leadframe TMPC1005H-220MG-D 22.0 5.0 9.0 50 60 leadframe TMPC1005H-240MG-D 24.0 4.6 7.7 59 70.8 leadframe TMPC1005H-330MG-D 33.0 4.3 7.5 80 92 leadframe TMPC1005H-470MG-D 47.0 3.8 6.5 125 145 leadframe TMPC1005H-680MG-D 68.0 2.5 4.0 176 205 leadframe TMPC1005H-101MG-D 100 2.0 3.0 315 380 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. |
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