1

VCC

12

GND

2

IN1±

11

IN4+

3

NC

10

NC

4

IN1+

9

IN4±

Not to scale

Thermal

Pad

1

2

3

4

5

6

7

IN1±

IN1+

IN2±

IN2+

VCC

OUT1

OUT2

IN4±

IN3+

IN3±

GND

OUT4

OUT3

IN4+

14

13

12

11

10

9

8

4

LM393LV-Q1

SNOSDB3 – JUNE 2020

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Copyright © 2020, Texas Instruments Incorporated

D, PW Package

14-Pin SOIC, TSSOP

Top View

RTE Package

16-Pad WQFN With Exposed Thermal Pad

Top View

NOTE: Connect exposed thermal pad

directly to GND pin.

(1)

Some manufacturers transpose the names of channels 1 & 2. Electrically the pinouts are identical, just a difference in channel naming

convention.

Pin Functions: LM339LV-Q1

PIN

I/O

DESCRIPTION

SOIC

WQFN

OUT1

1

15

Output

Output pin of the comparator 1

OUT2

2

16

Output

Output pin of the comparator 2

3

1

—

Positive supply

IN2–

4

2

Input

Negative input pin of the comparator 2

IN2+

5

4

Input

Positive input pin of the comparator 2

IN1–

6

5

Input

Negative input pin of the comparator 1

IN1+

7

6

Input

Positive input pin of the comparator 1

IN3–

8

7

Input

Negative input pin of the comparator 3

IN3+

9

8

Input

Positive input pin of the comparator 3

IN4–

10

9

Input

Negative input pin of the comparator 4

IN4+

11

11

Input

Positive input pin of the comparator 4

GND

12

12

—

Negative (low) supply or ground (for single-supply operation)

OUT3

13

13

Output

Output pin of the comparator 4

OUT4

14

14

Output

Output pin of the comparator 3

NC

—

3

—

No Internal Connection - Leave floating or GND

NC

—

10

—

No Internal Connection - Leave floating or GND

Thermal Pad

—

PAD

—

Connect directly to GND pin

Quad pinouts provided for preview information only. Quad device is expected to have specifications

similar to the dual.