PRELIMINARY

FPD10000V

Phone: +1 408 850-5790

http:/www.filtronic.co.uk/semis

Revised: 8/5/05

Fax: +1 408 850-5766

Email: sales@filcsi.com

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APPLICATIONS NOTES & DESIGN DATA

Recommendations on matching circuits is available from your local Filtronic Sales Representative or

directly from the factory. User must ensure that proper bias sequencing is observed: Gate bias

must be applied before Drain bias, and during power-down the Drain bias must be removed

first.

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BONDING / ASSEMBLY DIAGRAM

Notes:

25

µm (0.001 in.) gold wire is recommended. No Source wire bonds are needed, device

features Source thru-vias. 16 bonds each side, Gate and Drain.

User must ensure that the die attach material is uniform and free of voiding underneath the

die to ensure proper thermal heatsinking. A useful guideline is a 0.001 – 0.002 in. (0.025 –

0.050 mm) fillet of die attach material all around the periphery of the die.

All information and specifications are subject to change without notice.