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EXAMPLE STENCIL DESIGN

16X (1.65)

16X (0.6)

14X (1.27)

(9.75)

16X (2)

16X (0.6)

14X (1.27)

(9.3)

4223098/A 07/2016

SOIC - 2.65 mm max height

DWE0016A

SOIC

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SYMM

1

8

9

16

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

SYMM

SYMM

1

8

9

16

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE