USB3343 datasheet(84/92 Pages) MICROCHIP

84 / 92 page

USB334x

DS00002646A-page 84

 2009-2018 Microchip Technology Inc.

FIGURE 9-1:

24-Pin Sawn QFN - USB3341 Only (CONTINUED)

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

2.60

MILLIMETERS

0.50 BSC

MIN

MAX

3.90

Contact Pad Length (X24)

Contact Pad Width (X24)

0.85

0.30

Microchip Technology Drawing C04-2143A MJ

NOM

24-Lead Very Thin Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [VQFN]

SILK SCREEN

Contact Pad Spacing

3.90

Contact Pad to Center Pad (X24)

0.23

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

ØV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Contact Pad (X20)

0.20

USB3343 Datenblatt(PDF) 84 Page - Microchip Technology

USB3343 Datenblatt(HTML) 84 Page - Microchip Technology

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