Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................4

Pin Functions.................................................................... 4

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings ....................................... 5

7.2 ESD Ratings .............................................................. 5

7.3 Recommended Operating Conditions ........................5

7.4 Thermal Information ...................................................5

7.5 Electrical Characteristics ............................................6

7.6 Typical Characteristics................................................ 7

8 Detailed Description........................................................9

8.1 Overview..................................................................... 9

8.2 Functional Block Diagram........................................... 9

8.3 Feature Description...................................................10

8.4 Device Functional Modes..........................................10

9 Application and Implementation.................................. 11

9.1 Application Information..............................................11

9.2 Typical Application.................................................... 11

10 Power Supply Recommendations..............................16

11 Layout........................................................................... 16

11.1 Layout Guidelines................................................... 16

11.2 Layout Example...................................................... 16

12 Device and Documentation Support..........................17

12.1 Receiving Notification of Documentation Updates..17

12.2 Support Resources................................................. 17

12.3 Trademarks.............................................................17

12.4 Electrostatic Discharge Caution..............................17

12.5 Glossary..................................................................17

13 Mechanical, Packaging, and Orderable

Information.................................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (June 2020) to Revision B (November 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added AEC-Q100 Temperature Grade 0 rating for SOT-5X3/DYA package...................................................... 1

• Moved HBM and CDM ESD classification levels to ESD Ratings table............................................................. 1

• Added DYA (SOT-5X3) package.........................................................................................................................1

• Updated DYA maximum temperature rating to 150 °C in device comparison table........................................... 3

• Changed Junction temperature from 150 °C to 155 °C in Absolute Maximum Ratings Table............................ 5

• Changed Storage temperature from 150 °C to 155 °C in Absolute Maximum Ratings Table.............................5

• Added DYA Ambient Temperature Rating to Recommended Operating Conditions Table.................................5

• Added DYA Long Term Drift specifications......................................................................................................... 6

• Changed Typical Characteristics section............................................................................................................7

• Added Application Curve section......................................................................................................................16

Changes from Revision Original (March 2019) to Revision A (June 2020)

Page

• Changed data sheet status from: Advanced Information to: Production Data....................................................1

• Added Device Comparison table........................................................................................................................ 3

TMP64-Q1

SNIS220B – MARCH 2020 – REVISED NOVEMBER 2020

www.ti.com

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