TPS53676 datasheet(5/143 Pages) TI

5 / 143 page

Table 5-2. Pin Functions (continued)

I/O

DESCRIPTION

NAME

NO.

BTSEN / ATSEN /

TSEN

Multi-function pin. Configure through PMBus.

BTSEN (default): Connect to the TAO pin of the TI smart power stages of channel B to sense the

highest temperature of the power stages and to sense the built-in fault signal from the power stages.

BTSEN: Connect to the TAO pin of the TI smart power stages of channel A to sense the highest

temperature of the power stages and to sense the built-in fault signal from the power stages.

TSEN: Connect to the TAO pin of the TI smart power stages of channels A and B to sense the highest

temperature of the power stages and to sense the built-in fault signal from the power stages.

Float unused TSEN pins.

BVR_EN /

RESET# / SYNC

I/O

Multi-function pin. Configure through PMBus.

BVR_EN (Default) : Active high enable input for channel B. Asserting the BVR_EN pin activates

channel B. Polarity and enable conditions are programmable through ON_OFF_CONFIG.

RESET#: Active low signal which causes both channels output voltage target to revert to their

respective VBOOT values when asserted. Pull-up to 3.3 V.

SYNC: If assigned as an output, this pin provides a free-running clock for other TPS53676 devices to

synchronize to. If assigned as an input, an internal phase locked-loop can synchronize switching of

one or both channels to a clock supplied to this pin. Phase shift and data direction are programmable

through NVM.

BVR_RDY

VRD "Ready" output signal of channel B. This open drain output requires an external pull-up resistor.

The BVR_RDY pin is pulled low when a shutdown fault occurs.

BVSN

Negative input of the remote voltage sense of channel B. If channel B is not used, connect BVSN to

GND.

BVSP

Positive input of the remote voltage sense of channel B. If channel B is not used, connect BVSP to

GND.

CSPIN

Positive terminal of the integrated high-side current sensing amplifier. Connect to the supply side of

the input current sense element. Tie to VIN_CSNIN, and to the input voltage, if measured input current

sensing is not used.

SMB_ALERT#

SMBus or I2C bi-directional alert pin interface. (Open drain)

SMB_CLK

SMBus or I2C serial clock interface. (Open drain)

SMB_DIO

I/O

SMBus or I2C bi-directional serial data interface. (Open drain)

VCC

3.3-V power input. Bypass to GND with a ceramic capacitor with a value greater than or equal to 1 µF.

Used to power all digital logic circuits.

VIN_CSNIN

Negative terminal of the integrated high-side current sense amplifier. Connect to the power-stage side

of the current sense element. The VIN_CSNIN voltage is also used to determine the correct on-time

for the converter. Tie to CSPIN, and to the input voltage, if measured input current sensing is not used.

VREF

1.5-V LDO reference voltage. Bypass to GND with 1-µF effective ceramic capacitor. Connect the

VREF pin to the REFIN pin of the TI smart power stages as the current sense common-mode voltage.

VR_FAULT#

VR fault indicator. (Open-drain). The failures include the high-side FETs short, over-voltage, over-

temperature, and the input over-current conditions. Use the fault signal on the platform to remove the

power source by turning off the AC power supply. When the failure occurs, the VR_FAULT# pin is

LOW, and put the controller into latch-off mode.

Thermal Pad

Analog ground pad. Connect to GND plan with vias.

www.ti.com

TPS53676

SLUSDP0 – DECEMBER 2020

Submit Document Feedback

Product Folder Links: TPS53676

TPS53676 Datenblatt(PDF) 5 Page - Texas Instruments

TPS53676 Datenblatt(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datenblatt Download

Link URL