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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TLV9152SIRUGR Datenblatt(PDF) 12 Page - Texas Instruments |
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TLV9152SIRUGR Datenblatt(HTML) 12 Page - Texas Instruments |
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12 / 72 page  6.4 Thermal Information for Single Channel (continued) THERMAL METRIC (1) TLV9151, TLV9151S UNIT DBV (SOT-23) DCK (SC70) DRL (2) (SOT-553) 5 PINS 6 PINS 5 PINS 5 PINS 6 PINS RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A TBD TBD °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) This package option is preview for TLV9151. 6.5 Thermal Information for Dual Channel THERMAL METRIC (1) TLV9152, TLV9152S UNIT D (SOIC) DDF (SOT-23-8) DGK (2) (VSSOP) DGS (2) (VSSOP) DSG (WSON) PW (TSSOP) RUG (X2QFN) 8 PINS 8 PINS 8 PINS 10 PINS 8 PINS 8 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 138.7 143.5 176.5 TBD 77.6 185.1 142.3 °C/W Rθ JC(top) Junction-to-case (top) thermal resistance 78.7 79.9 68.1 TBD 93.7 74.0 53.5 °C/W RθJB Junction-to-board thermal resistance 82.2 61.6 98.2 TBD 43.9 115.7 68.5 °C/W ψJT Junction-to-top characterization parameter 27.8 5.7 12.0 TBD 4.4 12.3 1.0 °C/W ψJB Junction-to-board characterization parameter 81.4 61.3 96.7 TBD 43.9 114.0 68.4 °C/W Rθ JC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A TBD 19.0 N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) This package option is preview for TLV9152. 6.6 Thermal Information for Quad Channel THERMAL METRIC (1) TLV9154, TLV9154S UNIT D (SOIC) PW (TSSOP) RTE (2) (WQFN) RUC (WQFN) 14 PINS 14 PINS 16 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 101.4 131.4 TBD 125.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 57.6 51.8 TBD 39.8 °C/W RθJB Junction-to-board thermal resistance 57.3 75.8 TBD 68.0 °C/W ψJT Junction-to-top characterization parameter 18.5 7.9 TBD 0.8 °C/W ψJB Junction-to-board characterization parameter 56.9 74.8 TBD 67.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A TBD N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) This package option is preview for TLV9154. TLV9151, TLV9152, TLV9154 SBOS986C – OCTOBER 2019 – REVISED DECEMBER 2020 www.ti.com 12 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: TLV9151 TLV9152 TLV9154 |
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