FEATURES:

Glass Passivated Chip Junction

• Reverse Voltage - 100 to 1000 V

• Forward Current - 3.0 A

• High Surge Current Capability

• Designed for Surface Mount Application

•

MECHANICAL DATA

• Case:DBF

• Terminals: Solderable per MIL-STD-750, Method 2026

A

•

pprox. Weight: 0.234g / 0.00825oz

Output Cathode（-）

PINNING

PIN

1

2

DESCRIPTION

3

4

Output Anode（+）

Input Pin（~）

Input Pin（~）

4

3

2

1

ackage

+

-

~

~

（2）

（1）

（3）

（4）

Maximum Ratings and Electrical characteristics

Ratings at 25

ambient temperature unless otherwise specified.

Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %.

°C

Note: 1. Measured at 1MHz and applied reverse voltage of 4 V D.C.

2. Mounted on glass epoxy PC board with 4

×

×

（

×

）copper pad.

1.5" 1.5"

3.81 3.81 cm

Maximum DC Blocking Voltage

Peak Forward Surge Current 8.3 ms Single Half

Sine Wave Superimposed on Rated Load

(JEDEC Method)

Maximum Forward Voltage at 3.0 A

Parameter

Maximum Repetitive Peak Reverse Voltage

Maximum RMS voltage

Operating and Storage Temperature Range

Typical Junction Capacitance

（Note1）

V

V

V

3.0

120

1.1

40

-55 ~ +150

A

A

V

μA

pF

°C

Units

T , T

j

stg

Symbols

Average Rectified Output Current

100

200

400

600

800

1000

100

200

400

600

800

1000

70

140

280

420

560

700

Maximum DC Reverse Current

at Rated DC Blocking Voltage

5

100

@

A

@

A

TMBF301 TMBF302

304

306

308

3 10

60

10

25

Typical Thermal Resistance

（Note2）

R

θJC

R

θJL

°C/W

TMBF301 THRU TMBF310

SURFACE MOUNT BRIDGE RECTIFIERS

TMBF

TMBF

TMBF

TMBF

DBF P

http://www.trr-jx.com

version: 02