LTM8083EY datasheet(2/24 Pages) AD

2 / 24 page

LTM8083

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, SVIN, EN/UVLO, .................................................40V

VOUT, ISP, ISN ...........................................................40V

OVLO, CTRL, FB, SYNC, INTVCC .................................5V

ISP-ISN ............................................................–1V to 1V

Operating Junction Temperature Range

(Notes 2, 3)............................................ –40°C to 125°C

Storage Temperature Range .................. –55°C to 150°C

Solder Temperature ..............................................260°C

(Note 1)

BGA PACKAGE

49-LEAD (6.25mm × 6.25mm × 2.22mm)

TJMAX = 125°C, θJA = 23°C/W,

θJCtop = 21.8°C/W, θJCbottom = 7.6°C/W

TOP VIEW

NOTE:

1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS.

2) θJA VALUE IS OBTAINED WITH DEMO BOARD.

3) REFER TO PAGE 16 FOR LAB MEASUREMENT AND DERATING INFORMATION.

4) WEIGHT = 231mg

OVLO

BANK 1

VIN

BANK 0

GND

BANK 2

VOUT

TST2

SVIN EN/UVLO INTVCC ISMON

GND

TST1

SYNC

ISP

ISN

CTRL

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

DEVICE

FINISH CODE

LTM8083EY#PBF

SAC305 (RoHS)

8083

BGA

–40°C to 125°C

LTM8083IY#PBF

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

*The temperature grade is identified by a label on the shipping container.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

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