AMMC-3041 datasheet(4/5 Pages) BOARDCOM

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Applications Information

Operation of the AMMC- 3041 is very straightforward.

The RF, LO, and IF ports can be connected directly to

Ω circuits. None of the three ports should have a

DC voltage applied to them. If DC voltages are present,

a blocking capacitor should be used.

Some enhancement in Conversion Loss may be

obtained by reflectively terminating the LO and RF

signals at the IF port. This is easily done by connecting

a 20- mil long bond wire from the IF output pad on

the MMIC to a shunt, off-chip 0.5 pF chip capacitor as

indicated in Figure 7.

For up conversion applications, the input signal is nor-

mally applied to the IF port, the local oscillator

connected to the LO port, and the up-converted

output signal taken from the RF port.

Assembly Techniques

The backside of the AMMC- 3041 chip is RF ground. For

microstripline applications, the chip should be attached

directly to the ground plane (e.g., circuit carrier) using

electrically conductive epoxy[1].

For best performance, the topside of the MMIC should

be brought up to the same height as the circuit sur-

rounding it. This can be accomplished by mounting a

gold plated metal shim (same length and width as the

MMIC) under the chip, which is of the correct thickness

to make the chip and adjacent circuit coplanar.

The amount of epoxy used for chip and or shim attach-

ment should be just enough to provide a thin fillet

around the bottom perimeter of the chip or shim. The

ground plane should be free of any residue that may

jeopardize electrical or mechanical attachment.

For use on coplanar circuits, the chip can be mounted

directly on the topside ground plane of the circuit.

The location of the RF, LO, and IF bond pads is shown in

Figure 8. Note that all I/O ports are in a Ground-Signal-

Ground configuration. The IF port is located near the

middle of the die, which allows this connection to be

made from either side of the chip for maximum layout

flexibility.

RF connections should be kept as short as reasonable

to minimize performance degradation due to series in-

ductance. A single bond wire is sufficient for all signal

connections. However, doublebonding with 0.7 mil gold

wire or the use of gold mesh[2] is recommended for best

performance, especially near the high end of the fre-

quency range.

Thermosonic wedge bonding is the preferred method

for wire attachment to the bond pads. Gold mesh can

be attached using a 2 mil round tracking tool and a tool

force of approximately 22 grams with an ultrasonic

power of roughly 55 dB for a duration of 76

± 8 mS.

A guided wedge at an ultrasonic power level of 64 dB

can be used for the 0.7 mil wire. The recommended

wire bond stage temperature is 150

± 2°C.

Caution should be taken to not exceed the Absolute

Maximum Rating for assembly temperature and time.

The chip is 100

µm thick and should be handled with

care. This MMIC has exposed air bridges on the top

surface and should be handled by the edges or with a

custom collet (do not pick up die with vacuum on die

center.)

This MMIC is also static sensitive and ESD handling pre-

cautions should be taken.

Notes:

1. Ablebond 84-1 LM1 silver epoxy is recommended.

2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824.

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