 2018 Microchip Technology Inc.

DS20005972A-page 17

MX55/57

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

1.27 BSC

MIN

E

MAX

Contact Pad Length (X6)

Contact Pad Width (X6)

Y

X

1.25

0.75

Microchip Technology Drawing C04-3068A

NOM

SILK SCREEN

C

Contact Pad Spacing

2.35

Spacing Between Pads (X4)

G1

0.52

Spacing Between Pads (X3)

G2

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

C

Y

X

G1

1.10

6-Lead Low Profile Land Grid Array (ANA) - 5.0x3.2 mm Body [LLGA]

G2

6

12