6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

5.5

V

Input voltage

V

Differential input voltage

1

V

VOUT

Output voltage

V

Continuous input current

±10

mA

Continuous output current(2)

±100

mA

Junction temperature

150

°C

Operating free-air temperature

–40

125

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Long-term continuous output current for electromigration limits.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±1500

V

Charged-device model (CDM), per AEC

Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3.3

5

5.25

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA855-Q1

UNIT

DSG (WSON)

8 PINS

Junction-to-ambient thermal resistance

80.1

°C/W

Junction-to-case (top) thermal resistance

100

°C/W

Junction-to-board thermal resistance

45

°C/W

Junction-to-top characterization parameter

6.8

°C/W

Junction-to-board characterization parameter

45.2

°C/W

Junction-to-case (bottom) thermal resistance

22.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

OPA855-Q1

SBOSA57 – FEBRUARY 2021

Copyright © 2021 Texas Instruments Incorporated

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