7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

IN

–0.3

13

V

EN

–0.3

IN + 0.3

V

Output voltage

–0.3

5.5

V

Output short circuit current

20

mA

Operating temperature range

–55

150

°C

Storage temperature range

–65

170

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions

beyond those specified in the Electrical Characteristics Table is not implied.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/

JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC

specification JESD22-C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

IN

Input Voltage

12

V

EN

Enable Voltage

0

IN

V

Output Current

–10

10

mA

Operating Temperature

–40

25

125

°C

(1)

7.4 Thermal Information

THERMAL METRIC(1)

REF34

UNIT

DBV

6 PINS

Junction-to-ambient thermal resistance

185

°C/W

Junction-to-case (top) thermal resistance

156

°C/W

Junction-to-board thermal resistance

29.6

°C/W

Junction-to-top characterization parameter

33.8

°C/W

Junction-to-board characterization parameter

29.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

REF3425, REF3430, REF3433, REF3440, REF3450

SBAS804C – SEPTEMBER 2017 – REVISED FEBRUARY 2021

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