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ADRF5300BCCZN-R7 Datenblatt(PDF) 4 Page - Analog Devices |
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ADRF5300BCCZN-R7 Datenblatt(HTML) 4 Page - Analog Devices |
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4 / 11 page ![]() ADRF5300 Data Sheet Rev. 0 | Page 4 of 11 ABSOLUTE MAXIMUM RATINGS For the recommended operating conditions, see Table 1. Table 3. Parameter Rating Positive Supply Voltage −0.3 V to +3.6 V Digital Control Inputs Voltage −0.3 V to VDD + 0.3 V Current 3 mA RF Input Power (VDD = 3.3 V, f = 24 GHz to 32 GHz at TCASE = 85 °C) Average 28.5 dBm Peak 36.5 dBm RF Input Power Under Unbiased Condition (VDD = 0 V) Average 28 dBm Peak 36 dBm Temperature Junction 135°C Storage −65°C to +150°C Reflow 260°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is linked directly to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 4. Thermal Resistance Package Type θJC Unit CC-20-9 385 °C/W ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Field induced charged device model (FICDM) per ANSI/ESDA/ JEDEC JS-002. ESD Ratings for ADRF5300 Table 5. ADRF5300, 20-Terminal LGA ESD Model Withstand Threshold (V) HBM All Pins ±1000 Supply and Control Pins ±4000 FICDM ±1250 ESD CAUTION |
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