SGP40-D-R4 datasheet(16/19 Pages) SENSIRION

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Version 1.0 – July 2020 – D1

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5.3 Land Pattern

Recommended land pattern of the SGP40 is shown in Figure 13. Pads on PCB are recommended to be non-solder mask

defined (NSMD). Recommended solder paste stencil thickness is 125–150

m.

Figure 13 Recommended land pattern.

5.4 Soldering Instructions

Standard reflow soldering ovens and “no clean” type 3 solder paste (as specified in IPC J-STD-005A) should be used for

soldering the SGP40. The sensors are designed to withstand a soldering profile according to IPC/JEDEC J-STD-020. Peak

temperatures of TP = 245 °C during up to tp = 30 s for Pb-free assembly in IR/Convection reflow ovens (see Figure 14) are

recommended. In addition, we also recommend a maximum ramp-down rate of <4 °C s−1. Vapor phase or manual soldering

should not be used in order to avoid damaging of the sensor. In case the PCB hosting the SGP40 chip passes through multiple

solder cycles, it is recommended to assemble the SGP40 during the last solder cycle. Board wash and ultrasonic cleaning should

be avoided. For general information (such as conformal coating), please also refer to the Handling and Assembly Instructions

for SGPxx Gas Sensors.

Figure 14 Soldering profile according to JEDEC standard. Recommended

conditions are TP = 245°C and tP ≤ 30 s for Pb-free assembly, TL < 220°C

and tL < 150 s. Ramp-up rate <3°C s−1 and ramp-down rate <4°C s−1.

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