AMMC-6140-W50 datasheet(2/6 Pages) BOARDCOM

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AMMC-6140 DC Specifications/Physical Properties[1]

Symbol

Parameters and Test Conditions

Units

Min.

Typ.

Max.

Drain Supply Current (under any RF power drive and temperature) (V

d= 4.5V)

Gate Supply Operating Voltage

-1.5

-1.2

-1.0

ch-b

Thermal Resistance[2] (Backside Temp. T

b = 25°C)

°C/W

Notes:

1. Ambient operational temperature T

A= 25°C unless otherwise noted.

2. Channel-to-backside Thermal Resistance (θ

ch-b) = 26°C/W at Tchannel (Tc) = 34°C as measured using infrared microscopy. Thermal Resistance at

backside temperature (T

b) = 25°C calculated from measured data.

RF Specifications[3,4,5] (T

A = 25°C, Vd = 4.5 V, Id(Q)= 27 mA, Z0 = 50Ω)

Symbol

Parameters and Test Conditions

Units

Minimum

Typical

Sigma

Fin

Input Frequency

GHz

10 to 20

Fout

Output Frequency

GHz

20 to 40

Output Power[6]

dBm

-2

-1

0.4

Fundamental Isolation (referenced to Po): 20–36 GHz

dBc

5.0

36–40 GHz

dBc

1.0

3Fo

3rd Harmonic Isolation (referenced to Po)

dBc

1.2

-1dB

Output Power at 1dB Gain Compression

dBm

RLin

Input Return Loss[6]

-15

RLout

Output Return Loss[6]

-10

SSB

Single Sideband Phase Noise (100 KHz offset)

dBc/Hz

-135

Notes:

3. Small/large signal data measured in wafer form T

A = 25°C.

4. 100% on-wafer RF test is done at Pin = +4 dBm and output frequency = 20, 28, 36 and 40 GHz.

5. Specifications are derived from measurements in a 50Ω test environment. Aspects of the multiplier performance may be improved over a nar-

rower bandwidth by application of additional matching.

21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

Typical distribution of Pout, 2nd Harmonic and 3rd Harmonic Suppression (Fin=14 GHz).

Based on 2500 parts sampled over several production lots.

2Fo Pout (dBm) @ 28G Hz

Fo Suppression (dBm) @ 14 GHz

3Fo Suppression (dBm) @ 42 GHz

-2

-1

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