6 Pin Configuration and Functions

1

SEL1

16

SEL2

2

D1

15

D2

3

S1

14

S2

4

VSS

13

VDD

5

GND

12

FF

6

S4

11

S3

7

D4

10

D3

8

SEL4

9

SEL3

Not to scale

Figure 6-1. PW Package 16-Pin TSSOP Top View

1

S1

12

S2

2

VSS

11

VDD

3

GND

10

FF

4

S4

9

S3

Not to scale

Thermal

Pad

Figure 6-2. RRP Package 16-Pin WQFN Top View

Table 6-1. Pin Functions

PIN

TYPE(1)

DESCRIPTION

NAME

TSSOP

WQFN

D1

2

16

I/O

Drain pin 1. Can be an input or output.

D2

15

13

I/O

Drain pin 2. Can be an input or output.

D3

10

8

I/O

Drain pin 3. Can be an input or output.

D4

7

5

I/O

Drain pin 4. Can be an input or output.

FF

12

10

O

General fault flag. This pin is an open drain output and is asserted low when overvoltage

condition is detected on any of the source (Sx) input pins. Connect this pin to an external

supply (1.8 V to 5.5 V) through a 1 kΩ pull-up resistor.

GND

5

3

P

Ground (0 V) reference

S1

3

1

I/O

Overvoltage protected source pin 1. Can be an input or output.

S2

14

12

I/O

Overvoltage protected source pin 2. Can be an input or output.

S3

11

9

I/O

Overvoltage protected source pin 3. Can be an input or output.

S4

6

4

I/O

Overvoltage protected source pin 4. Can be an input or output.

SEL1

1

15

I

Logic control input 1.

SEL2

16

14

I

Logic control input 2.

SEL3

9

7

I

Logic control input 3.

SEL4

8

6

I

Logic control input 4.

13

11

P

Positive power supply. This pin is the most positive power-supply potential. Connect a

operation.

4

2

P

Negative power supply. This pin is the most negative power-supply potential. This pin can be

connected to ground in single-supply applications. Connect a decoupling capacitor ranging

Thermal Pad

—

The thermal pad is not connected internally. No requirement to solder this pad. It is

recommended that the pad be tied to GND or VSS for best performance.

(1)

I = input, O = output, I/O = input and output, P = power.

TMUX7411F, TMUX7412F, TMUX7413F

SCDS404 – MARCH 2021

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