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ADPA7007AEHZ-R7 Datenblatt(PDF) 23 Page - Analog Devices

Teilenummer ADPA7007AEHZ-R7
Bauteilbeschribung  20 GHz to 44 GHz, GaAs, pHEMT, 31.5 dBm (>1 W), MMIC Power Amplifier
PDF  23 Pages
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Hersteller  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADPA7007AEHZ-R7 Datenblatt(HTML) 23 Page - Analog Devices

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Data Sheet
ADPA7007
Rev. 0 | Page 23 of 23
OUTLINE DIMENSIONS
TOP VIEW
BOTTOM VIEW
SIDE VIEW
7.20
7.00 SQ
6.80
PIN 1
INDICATOR
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
4.55 BSC
SQ
5.40 SQ
1
4
5
9
10
13
14
18
1.00 BSC
3.10
3.00
2.90
4.50
4.40
4.30
3.55
3.45
3.35
1.75
1.65
1.55
0.31
0.25
0.19
0.60
0.50
0.40
1.21
1.15
1.09
0.63
0.57
0.51
0.80 REF
0.35 REF
0.89
1.05
1.444
1.317
1.190
Figure 64. 18-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]
(EH-18-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature
Range
MSL
Rating2
Package Description
Package
Option
ADPA7007AEHZ
−40°C to +85°C
MSL3
18-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]
EH-18-1
ADPA7007AEHZ-R7
−40°C to +85°C
MSL3
18-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]
EH-18-1
ADPA7007-EVALZ
1
Z = RoHS Compliant Part.
2
See the Absolute Maximum Ratings section for additional information.
©2020 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D21544-7/20(0)



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