7.4 Thermal Information

THERMAL METRIC(1)

OPAx607

UNIT

D (SOIC)

DGK

(VSSOP)

DBV

(SOT23)

DCK (SC70)

RUG

(X2QFN)

8 PINS

8 PINS

5 PINS

6 PINS

10 PINS

Junction-to-ambient thermal resistance

131.1

179

196.5

219.7

152

°C/W

Junction-to-case (top) thermal resistance

73.2

71

118.7

182.6

58

°C/W

Junction-to-board thermal resistance

74.5

101

64.5

105.7

77

°C/W

Junction-to-top characterization parameter

24.5

13

41.1

87

1.2

°C/W

Junction-to-board characterization parameter

73.3

100

64.2

105.4

77

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA607, OPA2607

SBOS981J – OCTOBER 2019 – REVISED APRIL 2021

www.ti.com

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