ADRF6821 datasheet(9/61 Pages) AD

9 / 61 page

Data Sheet

ADRF6821

Rev. A | Page 9 of 61

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

VCC_LO1, VCC_LO2, VCC_3V3_I,

VCC_3V3_Q, VCC_IFMIX_I,

VCC_IFMIX_Q, VCCVCO_3V3,

VCCDIV_3V3, VCCFBDIV_3V3,

VCCLO_MIX_3V3,

VCCLO_AUX_3V3, VCCCP_3V3,

VCCPFD_3V3, VCCREF_3V3,

VBAT_DIG_3V3

−0.3 V to +3.6 V

VCM_I, VCM_Q

−0.3 V to +3.3 V

CS, SCLK, SDIO, SDO

−0.3 V to +3.6 V

RF_SEL0, RF_SEL1, RFBT_FB

−0.3 V to +3.6 V

RFIN_FB0, RFIN_FB1

2.5 V peak, ac-coupled

RST, SLEEP

−0.3 V to +3.6 V

VTUNE, CPOUT, REF_IN, DCL_BIAS

−0.3 V to +3.6 V

RF Input Power RFIN

20 dBm

EXT_LO_IN−, EXT_LO_IN+

10 dBm, differential

Maximum Junction Temperature

125°C

Operating Temperature Range

(Measured at Paddle)

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Typical θJA and θJC are specified vs. the number of PCB layers.

The use of appropriate thermal management techniques is

recommended to ensure the maximum junction temperature

does not exceed the limits shown in Table 8.

Table 8. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-56-161

JEDEC 1s0p Board2

Not applicable

3.3

°C/W

Cold Plate Only, No PCB3

Not applicable

2.8

°C/W

JEDEC 2s2p Board2

29.3

Not applicable

°C/W

The maximum junction temperature of 125°C cannot be exceeded.

Per JEDEC JESD51-12.

For nonstandardized testing where the paddle of the device is directly

connected to a cold plate. This approach can be useful to estimate junction

temperature when the exact paddle temperature is known in the application.

ESD CAUTION

ADRF6821 Datenblatt(PDF) 9 Page - Analog Devices

ADRF6821 Datenblatt(HTML) 9 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61

Datenblatt Download

Link URL