STM32WLE4JCU6TR datasheet(140/145 Pages) STMICROELECTRONICS

140 / 145 page

Package information

STM32WLE5/E4xx

140/145

DS13105 Rev 8

6.4

Package thermal characteristics

The maximum chip junction temperature (TJ max) must never exceed the values given in

Table 25: General operating conditions.

The maximum chip-junction temperature, TJ max (in °C), can be calculated using the

equation:

TJ max = TA max + (PD max x ΘJA)

where:

•

TA max is the maximum ambient temperature in °C.

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W.

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max).

•

PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins:

PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

When the SMPS is used, a portion of the power consumption is dissipated into the external

inductor, therefore reducing the device power dissipation. This portion depends mainly on

the inductor ESR characteristics.

As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the

device power consumption.

RF characteristics (such as sensitivity, Tx power consumption) are provided up to 85 °C.

Table 98. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

UFBGA73 - 5 x 5 mm

UFQFPN48 - 7 x 7 mm

WLCSP59

20.1

27.4

TBD

°C/W

ΘJB

Thermal resistance junction-board

UFBGA73 - 5 x 5 mm

UFQFPN48 - 7 x 7 mm

WLCSP59

20.2

11.7

TBD

ΘJC

Thermal resistance junction-top case

UFBGA73 - 5 x 5 mm

UFQFPN48 - 7 x 7 mm

WLCSP59

31.1

8.5

TBD

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