OUTP, OUTN to GND............................................-0.3V to +80V

CSP_, CSN_ to GND ...........................................-0.3V to +0.3V

CSP_ to CSN_ .....................................................-0.3V to +0.3V

DRV to GND..........................................................-0.3V to +16V

BIAS to GND ...........................................................-0.3V to +6V

DRV to BIAS..........................................................-0.3V to +16V

FB, PGOOD, REFIN to GND ..................................-0.3V to +6V

EN/UVLO, FREQ/CLK to GND ...............................-0.3V to +6V

COMP, SS, ILIM, OVP, RAMP,

Maximum Current out of BIAS .........................................100mA

Operating Temperature Range......................... -40°C to +125°C

TQFN (derate 34.5mW/°C above +70°C)......................2.76W

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -40°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+240°C

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package Information

PACKAGE TYPE: 32-PIN TQFN

Package Code

T3255+6

Outline Number

21-0140

Land Pattern Number

90-0603

THERMAL RESISTANCE, FOUR-LAYER BOARD

29°C/W

1.7°C/W

www.maximintegrated.com

Maxim Integrated │ 3

MAX15158/MAX15158A

High-Voltage Multiphase Boost Controller