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K32L2AX Datenblatt(PDF) 84 Page - NXP Semiconductors

Teilenummer K32L2AX
Bauteilbeschribung  K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM
PDF  96 Pages
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Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

K32L2AX Datenblatt(HTML) 84 Page - NXP Semiconductors

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8.9 Human-machine interfaces (HMI)
8.9.1 TSI electrical specifications
Table 53. TSI electrical specifications
Symbol
Description
Min.
Typ.
Max.
Unit
TSI_RUNF
Fixed power consumption in run mode
—
100
—
µA
TSI_RUNV
Variable power consumption in run mode
(depends on oscillator's current selection)
1.0
—
128
µA
TSI_EN
Power consumption in enable mode
—
100
—
µA
TSI_DIS
Power consumption in disable mode
—
1.2
—
µA
TSI_TEN
TSI analog enable time
—
66
—
µs
TSI_CREF
TSI reference capacitor
—
1.0
—
pF
TSI_DVOLT
Voltage variation of VP & VM around nominal
values
0.19
—
1.03
V
9 Design considerations
9.1 Hardware design considerations
This device contains protective circuitry to guard against damage due to high static
voltage or electric fields. However, take normal precautions to avoid application of any
voltages higher than maximum-rated voltages to this high-impedance circuit.
9.1.1 Printed circuit board recommendations
• Place connectors or cables on one edge of the board and do not place digital circuits
between connectors.
• Drivers and filters for I/O functions must be placed as close to the connectors as
possible. Connect TVS devices at the connector to a good ground. Connect filter
capacitors at the connector to a good ground.
• Physically isolate analog circuits from digital circuits if possible.
• Place input filter capacitors as close to the MCU as possible.
• For best EMC performance, route signals as transmission lines; use a ground plane
directly under LQFP/MAPBGA packages.
Design considerations
84
K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021
NXP Semiconductors



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