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ADUCM3027BCBZ-R7 Datenblatt(PDF) 38 Page - Analog Devices

Teilenummer ADUCM3027BCBZ-R7
Bauteilbeschribung  Ultra Low Power Arm Cortex-M3 MCU with Integrated Power Management
PDF  39 Pages
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Hersteller  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADUCM3027BCBZ-R7 Datenblatt(HTML) 38 Page - Analog Devices

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ADuCM3027/ADuCM3029
Data Sheet
Rev. B | Page 38 of 39
OUTLINE DIMENSIONS
0.50
BSC
4.60
4.50 SQ
4.40
0.50
0.40
0.30
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
0.30
0.25
0.20
9.10
9.00 SQ
8.90
0.20 MIN
7.50 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WMMD
1
64
16
17
49
48
32
33
BOTTOM VIEW
TOP VIEW
END VIEW
SEATING
PLANE
EXPOSED
PAD
DETAIL A
(JEDEC 95)
P IN 1
IN D IC AT O R AR E A OP T IO N S
(SEE DETAIL A)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PIN 1
INDICATOR
AREA
Figure 29. 64-Lead Frame Chip Scale Package [LFCSP]
9 mm × 9 mm Body and 0.75 mm Package Height
(CP-64-16)
Dimensions shown in millimeters
0.530
0.470
0.410
2.800
2.760 SQ
2.720
0.210
0.180
0.150
0.320
0.290
0.260
0.280
0.240
0.200
BALL A1
IDENTIFIER
COPLANARITY
0.05
SEATING
PLANE
0.303
BSC
0.35
BSC
0.108
0.210
0.350
BSC
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
END VIEW
0.103
A
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
9
10
11
12
13
Figure 30. 54-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-54-1)
Dimensions shown in millimeters



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