7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

6

V

Input voltage

V

Differential input voltage(4)

±5

V

Continuous input current(2)

±10

mA

Continuous output current(3)

±20

mA

Continuous power dissipation

See Thermal Information

Maximum junction temperature

150

°C

Operating free-air temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails

should be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

(4)

Long term drift of offset voltage (> 1mV) if a differential input in excess of ≈ 2V is applied continuously between the IN+ and IN- pins at

elevated temperatures.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with ANSI/ESDA/JEDEC JS-001 Specification

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.2

5.5

V

±1.1

±2.75

Ambient operating temperature

–40

25

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

OPAx607-Q1

UNIT

DBV (SOT23)

DGK (VSSOP8)

5 PINS

8 PINS

Junction-to-ambient thermal resistance

196.5

179

°C/W

Junction-to-case (top) thermal resistance

118.7

71

°C/W

Junction-to-board thermal resistance

64.5

101

°C/W

Junction-to-top characterization parameter

41.1

13.7

°C/W

Junction-to-board characterization parameter

64.2

100

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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OPA607-Q1, OPA2607-Q1

SBOSA38A – FEBRUARY 2021 – REVISED APRIL 2021

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