Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours

of recovery under the standard condition.

Item

Performance

Test Condition

Shock

Appearance：No damage.

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

exceed the specification value

Bending

Shall be mounted on a FR4 substrate of the

following dimensions: >=0805:40x100x1.2mm

<0805:40x100x0.8mm

Bending depth: >=0805:1.2mm

<0805:0.8mm

duration of 10 sec.

Solderability

More than 95% of the terminal electrode should

be covered with solder。

Preheat: 150℃,60sec.。

Solder: Sn96.5% Ag3% Cu0.5%

Temperature: 245±5℃。

Flux for lead free: Rosin. 9.5%。

Dip time: 4±1sec。

Depth: completely cover the termination

Resistance

to Soldering

Heat

Appearance：No damage.

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

exceed the specification value

Number of heat cycles: 1

Terminal

Strength

Preconditioning:

Run

through

IR

reflow

for

2

times.( IPC/JEDEC J-STD-020DClassification

Reflow Profiles

With the component mounted on a PCB with the device to

be tested, apply a force

(>0805:1kg , <=0805:0.5kg)to the side of a device being

tested. This force shall be

applied for 60 +1 seconds. Also the force shall be applied

gradually as not to apply a

shock to the component being tested.

Temperature

(°C)

Time(s)

Temperature

ramp/immersion

and emersion rate

260 ±5(solder

temp)

10 ±1

25mm/s ±6 mm/s

Type

Peak

value

(g’s)

Normal

duration (D)

(ms)

Wave

form

Velocity

change

(Vi)ft/sec

SMD

50

11

Half-sine

11.3

Lead

50

11

Half-sine

11.3

Rev 2.0 :

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12.01.2019

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LM0605H-Series(G)-D