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ADP1649ACBZ-R7 Datenblatt(PDF) 28 Page - Analog Devices |
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ADP1649ACBZ-R7 Datenblatt(HTML) 28 Page - Analog Devices |
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28 / 28 page ![]() ADP1649 Data Sheet Rev. 0 | Page 28 of 28 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS Figure 43. 12-Ball Wafer Level Chip Scale Package [WLCSP] (CB-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option2 ADP1649ACBZ-R7 −40°C to +125°C 12-Ball Wafer Level Chip Scale Package [WLCSP] CB-12-4 ADP1649CB-EVALZ Evaluation Board WLCSP Package 1 Z = RoHS Compliant Part. 2 This package option is halide free. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). A B C D 0.660 0.602 0.544 1.54 1.50 1.46 2.04 2.00 1.96 1 2 3 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) 0.330 0.310 0.290 1.50 REF SEATING PLANE 1.00 REF 0.50 REF 0.380 0.352 0.324 0.280 0.250 0.220 0.04 MAX COPLANARITY 0.022 REF BALL A1 IDENTIFIER ©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10779-0-7/12(0) www.analog.com/ADP1649 |
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