NJL7502R

- 6 -

Ver.2014-12-02

MOUNTING METHOD

(note)

･Mounting was evaluated with the following profiles in our company, so there was no problem.

However, confirm mounting by the condition of your company beforehand.

･The exposure of device under higher temperature may affect to the reliability of the products, it is recommended to

complete soldering in the shortest time possible.

･Mounting : twice soldering is allowed.

INFRARED REFLOW SOLDERING METHOD

* Recommended reflow soldering procedure

(1) Using reflow furnace with short wave infrared radiation heater such halogen lamp regarding temperature profile.

Please refer to those of reflow furnace.

In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of

Black colored mold resin. Therefore, please avoid form direct exposure to mold resin.

(2) Other method

such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS)

are not appropriate because the body of device will be heated rapidly. Therefore, these are not

recommended to apply.

(3) The resin gets softened right after soldered, so the following care has to be taken.

Not to contact the lens surface to anything..

Not to dip the device into water or any solvents.

FLOW SOLDERING METHOD

* Flow soldering is not possible.

IRON SOLDERING METHOD

* Iron soldering is not possible.

CLEANING CONDITIONS

Please refrain from cleaning immediately after reflow of this device.

a

b

c

g

e

150

°C

260

°C

Room

Temp.

f

180

°C

230

°C

220

°C

d

a : Temperature ramping rate

: 1 to 4

°C/s

b : Pre-heating temperature

time

: 150 to 180

°C

: 60 to 120s

c : Temperature ramping rate

: 1 to 4

°C /s

d : 220

°C or higher time

: Shorter than 60s

e : 230

°C or higher time

: Shorter than 40s

f : Peak temperature

: Lower than 260

°C

g : Temperature ramping rate

: 1 to 6

°C /s

The temperature indicates at the surface of mold

package