| Datenblatt-Suchmaschine für elektronische Bauteile |
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SN74HCS08 Datenblatt(PDF) 2 Page - Texas Instruments |
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SN74HCS08 Datenblatt(HTML) 2 Page - Texas Instruments |
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2 / 31 page ![]() Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 Pin Functions.................................................................... 3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics.............................................5 6.6 Switching Characteristics............................................6 6.7 Typical Characteristics................................................ 6 7 Parameter Measurement Information............................ 7 8 Detailed Description........................................................8 8.1 Overview..................................................................... 8 8.2 Functional Block Diagram........................................... 8 8.3 Feature Description.....................................................8 8.4 Device Functional Modes............................................9 9 Application and Implementation.................................. 10 9.1 Application Information............................................. 10 9.2 Typical Application.................................................... 10 10 Power Supply Recommendations..............................13 11 Layout........................................................................... 13 11.1 Layout Guidelines................................................... 13 11.2 Layout Example...................................................... 13 12 Device and Documentation Support..........................14 12.1 Documentation Support.......................................... 14 12.2 Receiving Notification of Documentation Updates..14 12.3 Support Resources................................................. 14 12.4 Trademarks.............................................................14 12.5 Electrostatic Discharge Caution..............................14 12.6 Glossary..................................................................14 13 Mechanical, Packaging, and Orderable Information.................................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2021) to Revision E (December 2021) Page • Added DYY package information to Device Information Table .......................................................................... 1 • Added DYY package information to Pin Configuration and Functions .............................................................. 3 • Added DYY package to Thermal Information table............................................................................................ 5 Changes from Revision C (September 2019) to Revision D (March 2021) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 • Added BQA package information to Device Information ................................................................................... 1 • Added BQA package information to Pin Configuration and Functions .............................................................. 3 • Added BQA package to Thermal Information table............................................................................................ 5 Changes from Revision B (August 2019) to Revision C (September 2019) Page • Added D package to Device Information table................................................................................................... 1 • Added D package column to Thermal Information table.....................................................................................5 Changes from Revision A (July 2019) to Revision B (August 2019) Page • Deleted "ICC" and "output" from "Continuous current through VCC or GND" row for clarity................................ 4 Changes from Revision * (May 2019) to Revision A (July 2019) Page • Changed from Advanced Information to Production Data.................................................................................. 1 SN74HCS08-Q1 SCLS756E – MAY 2019 – REVISED DECEMBER 2021 www.ti.com 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HCS08-Q1 |
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