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STM32L15XCC Datenblatt(PDF) 119 Page - STMicroelectronics |
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STM32L15XCC Datenblatt(HTML) 119 Page - STMicroelectronics |
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119 / 136 page ![]() DocID022799 Rev 13 119/136 STM32L151xC STM32L152xC Package information 135 7.4 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information Figure 41. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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