tfs170_1.doc

version 2.2

01/99

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Specification

TFS 170/1 - 4/4

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VI TELEFILTER

Vectron International, Inc.

Potsdamer Straße 18

267 Lowell Road

D 14 513 TELTOW / Germany

Hudson, NH 03051 / USA

Tel: (+49) 3328 4784-52 / Fax: (+49) 3328 4784-30

Tel: (603) 598-0070 Fax: (603) 598-0075

E-Mail: tft@telefilter.com

E-Mail: vti@vtinh.com

VI TELEFILTER reserves the right to make changes to the product(s) and/or information contained herein without notice. No liability is

assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.

Air reflow temperature conditions

1st and 2nd air reflow profile

Name:

pre-heating periods

main-heating periods

peak temperature

Temperature:

150 °C - 170 °C

over 200 °C

230 °C ± 5 °C

Time:

60 sec. - 90 sec.

20 sec. - 25 sec.

Chip-mount air reflow profile

time / sec.

0

20

40

60

80

100

120

140

160

180

200

220

240

260

0

20

40

60

80

100

120

140

160

180

200

220

240

Table for temperature vs. time during the air reflow process

Tolerance of temperatures: ± 5 °C

time / sec.

temperature / °C

time / sec.

temperature / °C

0

23

140

160

10

34

150

161

20

46

160

164

30

60

170

170

40

80

180

180

50

103

190

205

60

121

195

230

70

134

200

255

80

143

205

230

90

150

210

205

100

154

215

180

110

156

220

165

120

158

230

140

130

159

240

120