ADM2461EBRWZ-R7 datasheet(21/21 Pages) AD

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Data Sheet

ADM2461E/ADM2463E

Rev. 0 | Page 21 of 21

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

1.27 (0.0500)

BSC

Figure 45. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body (RW-16)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

Data Rate (Mbps)

Duplex

Temperature Range

Package Description

Package Option

ADM2461EBRWZ

0.5

Half

−40°C to +125°C

16-Lead SOIC_W

RW-16

ADM2461EBRWZ-R7

0.5

Half

−40°C to +125°C

16-Lead SOIC_W

RW-16

ADM2463EBRWZ

0.5

Full

−40°C to +125°C

16-Lead SOIC_W

RW-16

ADM2463EBRWZ-RL7

0.5

Full

−40°C to +125°C

16-Lead SOIC_W

RW-16

EVAL-ADM2461EEBZ

Half-Duplex Evaluation Board

EVAL-ADM2463EEBZ

Full Duplex Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D21430-6/20(0)

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