PCA8530DUGSLASHDA datasheet(77/103 Pages) NXP

77 / 103 page

PCA8530

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 25 September 2014

77 of 103

NXP Semiconductors

PCA8530

Automotive 102 x 4 Chip-On-Glass LCD segment driver

15. Application information

15.1 ITO layout recommendations for ESD/EMC robustness in COG

applications

The crucial factor for gaining an EMC and ESD robust application is the quality of the

VSS1 line.

• To get an EMC/ESD robust ITO/glass layout, the RITO(VSS1) has to be kept as low as

possible.

• In the most common applications VSS1 is connected to the pins T1, T2, A0, A1, OSC,

SA0, SA1 and IFS (in the case of using the SPI interface) by using a very wide ITO

connection

• If possible, the ITO connection of VSS1 should be made wide, for example by fanning

out the other connections

• When the display is enabled, the charge and discharge caused by display activity

affects the VSS1 line. This causes a dynamic current in the VSS1 line which means

that dynamic voltage peaks in the VSS1 line may interfere with the low voltage part of

the PCA8530. Therefore a low RITO(VSS1) is also important for an improved noise

immunity of the PCA8530 especially at high VLCD values (VLCD >10V).

• A low RITO(VSS1) also improves the communication stability with the microcontroller by

reducing the effects of local ground (VSS1) bounce caused by high SDAACK

currents.

• It should be considered that VSS1 is internally connected to the IC substrate,

therefore noise on the VSS1 line causes noise inside the IC.

Figure 54 and Figure 55 are showing the recommended ITO connections for a COG

layout according to the interface type use.

PCA8530DUG/DA Datenblatt(PDF) 77 Page - NXP Semiconductors