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ATLS6A201D Datenblatt(PDF) 5 Page - Analog Technologies, Inc. |
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ATLS6A201D Datenblatt(HTML) 5 Page - Analog Technologies, Inc. |
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5 / 10 page ![]() 1161 Ringwood Ct, #110, San Jose, CA 95131, U. S. A. Tel.: (408) 748-9100, Fax: (408) 770-9187 www.analogtechnologies.com Copyrights 2000-2022, Analog Technologies, Inc. All Rights Reserved. Updated on 1/18/2022 Email: staff@analogti.com/sales@analogti.com 5 Analog Technologies ATLS6A201D Constant Current Laser Driver if no modulation is needed, an RC low pass filtered by be inserted between the DAC and the LIS pin. See Figure 5. The LIO can still be used to monitor the output current when the LIS is adjusted. 0V to 2.5V indicates the laser current of from 0A to 6A linearly. Monitoring the Output Current The output current of the driver can be monitored by measuring the voltage on the LIO pin. This feature is very useful for micro-driver based system where the ADC is available and monitoring the current in real time is required. This pin provides a very low noise voltage signal and is proportional to the output current: VLIO (V) = 2.5 (V) × IOUT (A)/6.0 (A). For example, when the output signal is 2.5V, the output current is 6A. LIO can be used to drive an ADC directly, and also be measured by a multi-meter. Figure 6 shows the relationship between Pin VPS and LDA. VVPS (V) VLDAMAX VLDAMIN Normal Operation Region IMAX = 6A 3.3 5 0.2 3.5 2.1 VLDA (V) Figure 6. VVPS vs. VLDA Driver Power Consumption The power consumption of the driver can be calculated by: PDRIVER = IIN × VVPS – IOUT × VLDA, where PDRIVER is the power consumed by the driver itself; IOUT is the output current; IIN is the power supply’s input current; VVPS is the power supply voltage; VLDA is the voltage across the laser diode; η = (IOUT × VLDA) / (IIN × VVPS). When the PDRIVER exceeds 1W, a heat sink might be needed. The best way for arranging the heat sinking for the driver is as follows: transferring the heat by sandwiching a piece of thermal conductive pad between the top metal surface of the laser driver and the internal metal surface of the final product as shown in Figure 7.1 and 7.2 below. The recommended thickness of the thermal conductive pad in Figure 7.1 is 1~4mm, and in Figure 7.2 is 0.5mm. ATI also provides a series of thermal conductive pads, click here for more information. Figure 7.1 Transferring Heat with Metal Enclosure |
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