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IRFD310 Datenblatt(PDF) 1 Page - Vishay Siliconix |
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IRFD310 Datenblatt(HTML) 1 Page - Vishay Siliconix |
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1 / 9 page ![]() IRFD310 www.vishay.com Vishay Siliconix S21-0887-Rev. D, 30-Aug-2021 1 Document Number: 91133 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power MOSFET FEATURES • Dynamic dV/dt rating • Repetitive avalanche rated • For automatic insertion • End stackable •Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The 4 pin DIP package is a low cost machine-insertiable case style which can be stacked in multiple combinations on standard 0.1" pin centers. The dual drain serveres as a thermal link to the mounting surface for power dissipation levels up to 1 W. Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. VDD = 50 V, starting TJ = 25 °C, L = 41 mH, Rg = 25 Ω, IAS = 1.4 A (see fig. 12) c. ISD ≤ 2.0 A, dI/dt ≤ 40 A/μs, VDD ≤ VDS, TJ ≤ 150 °C d. 1.6 mm from case PRODUCT SUMMARY VDS (V) 400 RDS(on) ( Ω)VGS = 10 V 3.6 Qg (Max.) (nC) 17 Qgs (nC) 3.4 Qgd (nC) 8.5 Configuration Single N-Channel MOSFET G D S HVMDIP D S G ORDERING INFORMATION Package HVMDIP Lead (Pb)-free IRFD310PbF ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-source voltage VDS 400 V Gate-source voltage VGS ± 20 Continuous drain current VGS at 10 V TA = 25 °C ID 0.35 A TA = 100 °C 0.22 Pulsed drain current a IDM 2.8 Linear derating factor 0.0083 W/°C Single pulse avalanche energy b EAS 46 mJ Repetitive avalanche current a IAR 0.35 A Repetitive avalanche energy a EAR 0.10 mJ Maximum power dissipation TA = 25 °C PD 1.0 W Peak diode recovery dV/dt c dV/dt 4.0 V/ns Operating junction and storage temperature range TJ, Tstg -55 to +150 °C Soldering recommendations (peak temperature) For 10 s 300d |
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