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FXLS8964AF Datenblatt(PDF) 89 Page - NXP Semiconductors |
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FXLS8964AF Datenblatt(HTML) 89 Page - NXP Semiconductors |
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89 / 98 page ![]() NXP Semiconductors FXLS8964AF 3-Axis Low-g Accelerometer 2 2 1 10X 0.25 0.15 10X 0.45 0.35 10X 0.400 Min1 2X 0.050 Typ2 2X 0.050 Typ2 2X 0.050 Typ2 2X 0.0375 Typ2 2X 0.0375 Typ2 10X 0.425 Min 0.450 Typ 10X 0.825 Min1 0.850 Typ 10X 1.0 Package outline 8X 0.4 8X 0.4 10X 0.200 Min 0.225 Typ 5 10 6 Package Solder mask PCB land pad Package outline PCB land pad [1] PCB pad lengths exterior to the package edge should be at least 0.4 mm long. If board space allows, a longer pad extension, such as 0.6 mm will generally result in more consistent fillet formation. This is because the inspectable solder fillet formation will be influenced less by PCB assembly issues, such as misalignment. [2] The solder mask clearance should be designed to be greater than or equal to PCB vendor's solder mask registration. Solder mask opening aaa-028908 Figure 29. PCB footprint guidelines 20 Glossary Term Description Cross-axis sensitivity Cross-axis sensitivity is the ratio of the measured acceleration for an axis to the input acceleration along each axis orthogonal to the measured axis. Cross-axis sensitivity leads to undesirable nonorthogonality of X, Y, and Z axes in the frame of reference of the assembled device when mapping to other frames of reference. Cross-axis sensitivity is expressed as a percentage of the orthogonal input acceleration with six separate cross-axis sensitivity terms known as Sxy, Sxz, Syx, Syz, Szx, and Szy. The cross-axis sensitivity specification represents the maximum of these six terms. Table 121. Glossary FXLS8964AF All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 3.4 — 7 December 2021 89 / 98 |
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