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FXLS8964AF Datenblatt(PDF) 89 Page - NXP Semiconductors

Teilenummer FXLS8964AF
Bauteilbeschribung  3-Axis Low-g Accelerometer
PDF  98 Pages
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Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
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FXLS8964AF Datenblatt(HTML) 89 Page - NXP Semiconductors

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NXP Semiconductors
FXLS8964AF
3-Axis Low-g Accelerometer
2
2
1
10X 0.25
0.15
10X 0.45
0.35
10X 0.400 Min1
2X 0.050 Typ2
2X 0.050 Typ2
2X 0.050 Typ2
2X 0.0375 Typ2
2X 0.0375 Typ2
10X 0.425 Min
0.450 Typ
10X 0.825 Min1
0.850 Typ
10X 1.0
Package outline
8X 0.4
8X 0.4
10X 0.200 Min
0.225 Typ
5
10
6
Package
Solder mask
PCB land pad
Package outline
PCB land pad
[1] PCB pad lengths exterior to the package edge should be at
least 0.4 mm long. If board space allows, a longer pad extension,
such as 0.6 mm will generally result in more consistent fillet
formation. This is because the inspectable solder fillet formation
will be influenced less by PCB assembly issues, such as misalignment.
[2] The solder mask clearance should be designed to be greater
than or equal to PCB vendor's solder mask registration.
Solder mask
opening
aaa-028908
Figure 29. PCB footprint guidelines
20 Glossary
Term
Description
Cross-axis sensitivity
Cross-axis sensitivity is the ratio of the measured acceleration for an axis to the input
acceleration along each axis orthogonal to the measured axis. Cross-axis sensitivity leads to
undesirable nonorthogonality of X, Y, and Z axes in the frame of reference of the assembled
device when mapping to other frames of reference. Cross-axis sensitivity is expressed as a
percentage of the orthogonal input acceleration with six separate cross-axis sensitivity terms
known as Sxy, Sxz, Syx, Syz, Szx, and Szy. The cross-axis sensitivity specification represents
the maximum of these six terms.
Table 121. Glossary
FXLS8964AF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2021. All rights reserved.
Product data sheet
Rev. 3.4 — 7 December 2021
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