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AS7421 Datenblatt(PDF) 9 Page - ams AG

Teilenummer AS7421
Bauteilbeschribung  64-Channel Hyperspectral NIR Sensor
PDF  53 Pages
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Hersteller  AMSCO [ams AG]
Direct Link  http://www.ams.com
Logo AMSCO - ams AG

AS7421 Datenblatt(HTML) 9 Page - ams AG

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AS7421
Absolute Maximum Ratings
Datasheet
• PUBLIC
DS000667
• v1-00 • 2022-Aug-25
52
│ 8
4
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only. Functional operation of the device at these or any other
conditions beyond those indicated under “Electrical Conditions” is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Figure 5
Absolute Maximum Ratings of AS7421
Symbol
Parameter
Min
Max
Unit
Comments
Electrical Parameters
VDD / VGND
Supply Voltage to Ground
-0.3
3.6
V
Applicable for pin VDD
VLEDA
LEDA Voltage to Ground
-0.3
3.6
V
Applicable for pin LEDA
VDIG_MAX
Digital pins
-0.3
VDD+0.3
V
Applicable for pins
SCL,SDA and INT
ISCR
Input Current (latch-up
immunity)
± 100
mA
JESD78E
Continuous Power Dissipation (TA = 70 °C)
PT
Continuous Power Dissipation
1.4
W
Including LEDs and
sensor
Electrostatic Discharge
ESDHBM
Electrostatic Discharge HBM
± 2000
V
JS-001-2017
ESDCDM
Electrostatic Discharge CDM
± 500
V
JS-002-2014
Temperature Ranges and Storage Conditions
TA
Ambient Temperature
-30
+85
°C
RTHJA
Junction to Ambient Thermal
Resistance
85
K/W
Depending on actual PCB
layout. (2)
TSTRG
Storage Temperature Range
-40
+85
°C
TBODY
Package Body Temperature
260
°C
IPC/JEDEC J-STD-020(1)
RHNC
Relative Humidity (non-
condensing)
5
85
%
MSL
Moisture Sensitivity Level
3
Maximum floor life time of
168h
(1)
The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.” The lead finish for Pb-
free leaded packages is “Matte Tin” (100 % Sn)
(2)
Value defined for PCB using 5x5mm copper area on bottom side of PCB. Thermal vias used to connect exposed pad
from TOP layer with bottom layer. Contact ams OSRAM for guidelines on thermal management.



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