L6364 datasheet(49/60 Pages) STMICROELECTRONICS

Teilenummer	L6364

Bauteilbeschribung	Dual channel transceiver IC for SIO and IO-Link sensor applications

PDF	60 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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49 / 60 page

QFN20L Package and Packing Mechanical Data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages

have a Lead-free second level interconnect. The category of second level interconnect is marked on the package

and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to

soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Figure 25. QFN20L mechanical drawings

Table 33. QFN20L Dimensions [mm]

SYMBOL

MIN.

TYP.

MAX.

0.80

0.90

1.00

0.02

0.65

1.00

0.25

0.18

0.23

0.30

3.85

4.00

4.15

2.60

2.70

2.80

3.85

4.00

4.15

2.60

2.70

2.80

0.45

0.50

0.55

0.30

0.40

0.50

ddd

0.08

L6364

QFN20L Package and Packing

Mechanical Data

DS13363 - Rev 4

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