2R075 datasheet(3/5 Pages) LEIDITECH

3 / 5 page

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min) )

150°C

- Temperature Max (T

s(max) )

200°C

- Time (Min to Max) (t

60 – 180 secs

Average ramp up rate (Liquidus Temp

L) to peak

3°C/second max

S(max) to TL - Ramp-up Rate

5°C/second max

- Temperature (T

L) (Liquidus)

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

260+0/-5 °C

Time within 5°C of actual peak

Temperature (t

10 – 30 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Time

TS(max)

TS(min)

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

TL to T P

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100

° C

Temperature Maximum:

150

° C

Preheat Time:

60-180 seconds

Solder Pot Temperature:

280

° C Maximum

Solder Dwell Time:

2-5 seconds

Recommended Process Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.

All data is subject to change,Please check our data sheets at

for updates.

GDT 0

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