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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TDA7562BEP Datenblatt(PDF) 21 Page - STMicroelectronics |
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TDA7562BEP Datenblatt(HTML) 21 Page - STMicroelectronics |
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21 / 34 page  DocID028961 Rev 1 21/34 TDA7562BEP Application suggestion 33 5 Application suggestion 5.1 PC-board hints The exposed pad package doesn't require any particular care compared with the ST standard Flexiwatt package. For particular PCB configurations, in order to maximize the rejection against any disturbances coming from the battery line (SVR), it is suggested to use one of the following IC metal slug (heat-sink) connections: leave the slug simply electrically isolated from the PCB ground; in case of 2 layers board, connect the slug to the PCB power ground (P-GND) and not to the signal ground (S-GND). In case of a PCB with a layer dedicated to grounding (wide / diffused GND area with no distinction between P-GND and S-GND) connect the slug to the common board ground. |
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