L99MOD51XP datasheet(28/33 Pages) STMICROELECTRONICS

Datenblatt-Suchmaschine für elektronische Bauteile

L99MOD51XP Datenblatt(PDF) 28 Page - STMicroelectronics

Teilenummer	L99MOD51XP

Bauteilbeschribung	Multi-output driver for automotive applications

PDF	33 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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28 / 33 page

Package and PCB thermal data

L99MOD51XP

28/33

DS12667 Rev 6

Package and PCB thermal data

6.1

PowerSSO-36 thermal data

Figure 10. PowerSSO-36 2 layer PCB

Figure 11. PowerSSO-36 4 layer PCB

Note:

Layout condition of Rth and Zth measurements (board finish thickness 1.6 mm ±10%, board

double layer and four layers, board dimension 129 mm x 60 mm, board material FR4, Cu

thickness 0.070 mm (outer layers), Cu thickness 0.035 mm (inner layers), thermal vias

separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias

0.025 mm, footprint dimension 4.1 mm x 6.5 mm). 4-layer PCB: Cu on mid1 and mid2 layer:

76.45 cm2. Cu on bottom layer: 68.8 cm2. Zth measured on the major power dissipator

contributor.

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