ADF4377 datasheet(9/79 Pages) AD

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Data Sheet

ADF4377

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 9 of 79

TA = 25°C, unless otherwise noted.

Table 3. Absolute Maximum Ratings

Parameter

Rating

V3.3V_1 (V3_LS, V3_LDO, V3_REF, V3_PFD,

V3_NDIV) to GND

−0.3 V to +3.6 V

V3.3V_2 (V3_VCO, V3_CLKDIV, V3_CLK1,

V3_CLK2) to GND

−0.3 V to +3.6 V

V5V (V5_CAL, V5_VCO, V5_CP) to GND

−0.3 V to +5.5 V

Voltage on CP Pin

−0.3 V to VV5_CP + 0.3 V

Digital Outputs (MUXOUT, LKDET, SDO, SDIO)

5 mA

CLK1P, CLK1N, CLK2P, CLK2N

Maximum (GND − 0.3 V,

V3.3V_2 − 1.2 V) to V3.3V_2 +

0.3 V

REFP, REFN

−0.65 V to V3.3V_1 + 0.65 V

Voltage on All Other Pins

−0.3 V to V3.3V_1 + 0.3 V

REFP to REFN, when V3.3V_1 > 3 V

±1.35 V

Operating Junction Temperature Range1

−40°C to +125°C

Storage Temperature Range

−40°C to +125°C

Maximum Junction Temperature

125°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

30 s

1 Device is guaranteed to meet the specified performance limits over the full

operating junction temperature range.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

TRANSISTOR COUNT

The transistor count for the ADF4377 is 114258 (CMOS) and 2941

(bipolar).

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required. θJA is the natural convection, junction

to ambient thermal resistance measured in a one cubic foot sealed

enclosure. θJC is the junction to case thermal resistance.

Table 4. Thermal Resistance

Package

Type

θJA

θJC-TOP

θJC-

BOTTOM

θJB

ΨJT

ΨJB

Unit

CC-48-6

28.7

25.8

6.3

13.1

2.6

13.7

°C/W

1 Test Condition 1: thermal impedance simulated values are based on use of a

4-layer PCB with the thermal impedance paddle soldered to a ground plane.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADF4377

Table 5. ADF4377, 48-Lead LGA

ESD Model

Withstand Threshold (V)

Class

HBM

3500

CDM

1250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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