SOIC−16

CASE 751B−05

ISSUE K

DATE 29 DEC 2006

SCALE 1:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

18

16

9

SEATING

PLANE

F

J

M

G

8 PL

P

−B−

−A−

M

0.25 (0.010)

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

9.80

10.00

0.386

0.393

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.229

0.244

R

0.25

0.50

0.010

0.019

____

6.40

16X

0.58

16X

1.12

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

STYLE 1:

PIN 1.

COLLECTOR

2.

BASE

3.

EMITTER

4.

NO CONNECTION

5.

EMITTER

6.

BASE

7.

COLLECTOR

8.

COLLECTOR

9.

BASE

10.

EMITTER

11.

NO CONNECTION

12.

EMITTER

13.

BASE

14.

COLLECTOR

15.

EMITTER

16.

COLLECTOR

STYLE 2:

PIN 1.

CATHODE

2.

ANODE

3.

NO CONNECTION

4.

CATHODE

5.

CATHODE

6.

NO CONNECTION

7.

ANODE

8.

CATHODE

9.

CATHODE

10.

ANODE

11.

NO CONNECTION

12.

CATHODE

13.

CATHODE

14.

NO CONNECTION

15.

ANODE

16.

CATHODE

STYLE 3:

PIN 1.

COLLECTOR, DYE #1

2.

BASE, #1

3.

EMITTER, #1

4.

COLLECTOR, #1

5.

COLLECTOR, #2

6.

BASE, #2

7.

EMITTER, #2

8.

COLLECTOR, #2

9.

COLLECTOR, #3

10.

BASE, #3

11.

EMITTER, #3

12.

COLLECTOR, #3

13.

COLLECTOR, #4

14.

BASE, #4

15.

EMITTER, #4

16.

COLLECTOR, #4

STYLE 4:

PIN 1.

COLLECTOR, DYE #1

2.

COLLECTOR, #1

3.

COLLECTOR, #2

4.

COLLECTOR, #2

5.

COLLECTOR, #3

6.

COLLECTOR, #3

7.

COLLECTOR, #4

8.

COLLECTOR, #4

9.

BASE, #4

10.

EMITTER, #4

11.

BASE, #3

12.

EMITTER, #3

13.

BASE, #2

14.

EMITTER, #2

15.

BASE, #1

16.

EMITTER, #1

STYLE 5:

PIN 1.

DRAIN, DYE #1

2.

DRAIN, #1

3.

DRAIN, #2

4.

DRAIN, #2

5.

DRAIN, #3

6.

DRAIN, #3

7.

DRAIN, #4

8.

DRAIN, #4

9.

GATE, #4

10.

SOURCE, #4

11.

GATE, #3

12.

SOURCE, #3

13.

GATE, #2

14.

SOURCE, #2

15.

GATE, #1

16.

SOURCE, #1

STYLE 6:

PIN 1.

CATHODE

2.

CATHODE

3.

CATHODE

4.

CATHODE

5.

CATHODE

6.

CATHODE

7.

CATHODE

8.

CATHODE

9.

ANODE

10.

ANODE

11.

ANODE

12.

ANODE

13.

ANODE

14.

ANODE

15.

ANODE

16.

ANODE

STYLE 7:

PIN 1.

SOURCE N‐CH

2.

COMMON DRAIN (OUTPUT)

3.

COMMON DRAIN (OUTPUT)

4.

GATE P‐CH

5.

COMMON DRAIN (OUTPUT)

6.

COMMON DRAIN (OUTPUT)

7.

COMMON DRAIN (OUTPUT)

8.

SOURCE P‐CH

9.

SOURCE P‐CH

10.

COMMON DRAIN (OUTPUT)

11.

COMMON DRAIN (OUTPUT)

12.

COMMON DRAIN (OUTPUT)

13.

GATE N‐CH

14.

COMMON DRAIN (OUTPUT)

15.

COMMON DRAIN (OUTPUT)

16.

SOURCE N‐CH

16

89

8X

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98ASB42566B

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

SOIC−16

© Semiconductor Components Industries, LLC, 2019

www.onsemi.com