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STM32G081EB Datenblatt(PDF) 110 Page - STMicroelectronics

Teilenummer STM32G081EB
Bauteilbeschribung  Arm® Cortex®-M0 32-bit MCU, 128 KB Flash, 36 KB RAM,4x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V
PDF  136 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G081EB Datenblatt(HTML) 110 Page - STMicroelectronics

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Package information
STM32G081xB
110/136
DS12231 Rev 4
Figure 33. Recommended PCB pad design for WLCSP25 package
Table 74. WLCSP25 mechanical data
Symbol
millimeters
inches(1)
1. Values in inches are converted from mm and rounded to 3 decimal digits.
Min
Typ
Max
Min
Typ
Max
A(2)
2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal
values and tolerances of A1 and A2.
-
-
0.59
-
-
0.023
A1
-
0.18
-
-
0.007
-
A2
-
0.38
-
-
0.015
-
A3
-
0.025(3)
3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process
capability.
--
0.001
-
b
0.22
0.25
0.28
0.009
0.010
0.011
D
2.28
2.30
2.32
0.090
0.091
0.091
E
2.46
2.48
2.50
0.097
0.098
0.098
e
-
0.40
-
-
0.016
-
e1
-
1.60
-
-
0.063
-
e2
-
1.60
-
-
0.063
-
F(4)
4. Calculated dimensions are rounded to the 3rd decimal place
-
0.350
-
-
0.014
-
G(4)
-
0.440
-
-
0.017
-
aaa
-
-
0.10
-
-
0.004
bbb
-
-
0.10
-
-
0.004
ccc
-
-
0.10
-
-
0.004
ddd
-
-
0.05
-
-
0.002
eee
-
-
0.05
-
-
0.002
MS18965V2
Dsm
Dpad



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