STM32G081EB datasheet(114/136 Pages) STMICROELECTRONICS

Teilenummer	STM32G081EB

Bauteilbeschribung	Arm® Cortex®-M0 32-bit MCU, 128 KB Flash, 36 KB RAM,4x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V

PDF	136 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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114 / 136 page

Package information

STM32G081xB

114/136

DS12231 Rev 4

6.3

UFQFPN32 package information

UFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch ultra-thin fine-pitch quad flat package.

Figure 38. UFQFPN32 package outline

1. Drawing is not to scale.

2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this backside pad to PCB ground.

Table 77. UFQFPN32 package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.500

0.550

0.600

0.0197

0.0217

0.0236

0.000

0.020

0.050

0.000

0.0007

0.0020

0.152

0.0060

0.180

0.230

0.280

0.0071

0.0091

0.0110

D(2)

2. Dimensions D and E do not include mold protrusion, not to exceed 0,15mm.

4.900

5.000

5.100

0.1929

0.1969

0.2008

3.400

3.500

3.600

0.1339

0.1378

0.1417

3.400

3.500

3.600

0.1339

0.1378

0.1417

E(2)

4.900

5.000

5.100

0.1929

0.1969

0.2008

3.400

3.500

3.600

0.1339

0.1378

0.1417

3.400

3.500

3.600

0.1339

0.1378

0.1417

0.500

0.0197

0.300

0.400

0.500

0.0118

0.0157

0.0197

ddd

0.080

0.0031

A0B8_ME_V3

PIN 1 Identifier

SEATINGPLANE

ddd

STM32G081EB Datenblatt(PDF) 114 Page - STMicroelectronics

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