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TN2540-12G Datenblatt(PDF) 3 Page - STMicroelectronics |
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TN2540-12G Datenblatt(HTML) 3 Page - STMicroelectronics |
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3 / 10 page ![]() Table 4. Thermal resistance parameter Symbol Parameter Value Unit Rth(j-c) Thermal resistance Junction to case (DC) Max. 1.0 °C/W 1.1 Characteristics (curves) Figure 1. Maximum average power dissipation versus average on-state current 0 2 4 6 8 10 12 14 16 18 20 22 24 0 2 4 6 8 10 12 14 16 IT(AV)(A) P(W) Figure 2. Average and DC on-state current versus case temperature 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 0 25 50 75 100 125 TCASE(°C) I T(AV)(A) D.C α = 180° Figure 3. Average and D.C. on state current versus ambient temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 Tamb(°C) I T(AV)(A) D.C α = 180° Figure 4. Relative variation of thermal impedance junction to case 1.0E-02 1.0E-01 1.0E+00 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 tP(s) K=[Z th(j-c) /Rth(j-c) ] Zth(j-c) TN2540-12G Characteristics (curves) DS12791 - Rev 1 page 3/10 |
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