Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Jun., 2005

APL5101/2

www.anpec.com.tw

14

Re liability test program

Test item

Method

Description

SOLDERABILITY

M IL-STD-883D-2003

245

°C , 5 SEC

HO LT

M IL-STD-883D-1005.7

1000 Hrs Bias @ 125

°C

PCT

JESD-22-B, A102

168 Hrs, 100 % RH , 121

°C

TST

M IL-STD-883D-1011.9

-65

°C ~ 150 °C , 200 Cycles

ESD

M IL-STD-883D-3015.7

VHBM > 2KV, VMM > 200V

Latch-Up

JESD 78

10ms , I

Carrier Tape

t

Ao

E

W

Po

P

Ko

Bo

D1

D

F

P1

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 mm

260 +0

°C*

260 +0

°C*

260 +0

°C*

1.6 mm – 2.5 mm

260 +0

°C*

250 +0

°C*

245 +0

°C*

≥2.5 mm

250 +0

°C*

245 +0

°C*

245 +0

°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the

stated classification temperature (this means Peak reflow temperature +0

°C. For example 260°C+0°C)

at the rated MSL level.

Table 1.

SnPb Entectic Process – Package Peak Reflow Temperature s

Package Thickness

Volume mm

3

<350

Volume mm

3

≥350

<2.5 mm

240 +0/-5

°C

225 +0/-5

°C

≥2.5 mm

225 +0/-5

°C

225 +0/-5

°C

Classification Reflow Profiles (Cont.)

A

J

B

T2

T1

C