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T543EM030CSS075 Datenblatt(PDF) 20 Page - Vishay Siliconix

Teilenummer T543EM030CSS075
Bauteilbeschribung  vPolyTanTM Polymer Surface-Mount Chip Capacitors, Low ESR, Leadframeless Molded Type, Hi-Rel Commercial Off-The-Shelf (COTS)
PDF  24 Pages
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Hersteller  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
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T543EM030CSS075 Datenblatt(HTML) 20 Page - Vishay Siliconix

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Polymer Guide
www.vishay.com
Vishay
Revision: 08-Sep-2022
9
Document Number: 40076
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKING AND STORAGE
Polymer capacitors meet moisture sensitivity level rating (MSL) of 3 or 4 as specified in IPC/JEDEC® J-STD-020 and are dry
packaged in moisture barrier bags (MBB) per J-STD-033. MSL for each particular family is defined in the datasheet - either in
“Features” section or “Standard Ratings” table. Level 3 specifies a floor life (out of bag) of 168 hours and level 4 specifies a floor
life of 72 hours at 30 °C maximum and 60 % relative humidity (RH). Unused capacitors should be re-sealed in the MBB with
fresh desiccant. A moisture strip (humidity indicator card) is included in the bag to assure dryness. To remove excess moisture,
capacitors can be dried at 40 °C (standard “dry box” conditions).
For detailed recommendations please refer to J-STD-033.
Note
(1) For T27, lead (Pb)-free capacitors tp = 30 s
Notes
• T50, T51, T52, T55, T56, and T58 capacitors are process sensitive.
PSL classification to JEDEC J-STD-075: R4G
• T54 and T59 capacitors with 100 % tin termination are process sensitive.
PSL classification to JEDEC J-STD-075: R6G
RECOMMENDED REFLOW PROFILES
Vishay recommends no more than 3 cycles of reflow in accordance with J-STD-020.
PROFILE FEATURE
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
PREHEAT AND SOAK
Temperature min. (TSmin.)
100 °C
150 °C
Temperature max. (TSmax.)
150 °C
200 °C
Time (tS) from (TSmin. to TSmax.)
60 s to 120 s
60 s to 120 s
RAMP UP
Ramp-up rate (TL to Tp)
3 °C/s maximum
Liquidus temperature (TL)
183 °C
217 °C
Time (tL) maintained above TL
60 s to 150 s
Peak package body temperature (Tp) max.
Depends on type and case - see table below
Time (tp) within 5 °C of the peak max. temperature
20 s
5 s (1)
RAMP DOWN
Ramp-down rate (Tp to TL)
6 °C/s maximum
Time from 25 °C to peak temperature
6 min maximum
8 min maximum
PEAK PACKAGE BODY TEMPERATURE (Tp) MAXIMUM
TYPE
CASE CODE
PEAK PACKAGE BODY TEMPERATURE (TP) MAX.
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
T27
D
220 °C
245 °C
T55
J, P, A, T, B, C, Z, V, D
n/a
260 °C
T52
E5, M1, M9, B2
260 °C
T58
MM, W9, W0, A0, BB
260 °C
T50
D
260 °C
T51
D, V
260 °C
T56
B, D, V
250 °C
T59
EE
220 °C
250 °C
T54
3E, 6E, EE, E2, E3, E4, E6
220 °C
250 °C
20021
EE
220 °C
n/a
Time
t
S
Time 25 °C to peak
t
p
T
P
T
L
T
Smin.
25
t
L
T
Smax.
Preheat area
Max. ramp up rate = 3 °C/s
Max. ramp down rate = 6 °C/s



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